Winmate and HPC Systems to Showcase Rugged Innovation at SEMICON Taiwan 2025

Taipei, 03 September 2025 – Winmate and HPC Systems is proud to announce its participation at SEMICON Taiwan 2025, one of the world’s leading semiconductor exhibitions. The event will take place from September 10 to 12, 2025, at TaiNEX 1 & 2 in Taipei, Taiwan.

About SEMICON Taiwan

As part of this forward-looking platform, Winmate will exhibit its rugged and intelligent computing solutions that support AI integration, enterprise mobility, and industrial automation.

Discover Winmate’s Latest Advancements!

As part of this forward-looking platform, Winmate will exhibit its rugged and intelligent computing solutions that support AI integration, enterprise mobility, and industrial automation.

Featured Solutions at Booth K2167:

• End-to-End Radio Gateway Solutions

  Explore Winmate’s advanced multi-mode PoC radios and radio gateway systems designed for uninterrupted communication across teams, devices, and platforms. These solutions bridge traditional LMR (Land Mobile Radio) systems with modern LTE/5G networks, enabling centralized control and long-range interoperability—ideal for semiconductor factories, field service teams, and critical operations where instant communication is vital.

• Industrial IP67 Panel PC Solutions

  Winmate’s IP67 Panel PCs are built for extreme industrial conditions, dusty production lines, humid cleanrooms, or outdoor factory sites. Engineered with full waterproof and dustproof protection, these systems deliver reliable performance, sunlight-readable displays, and wide temperature tolerance, supporting equipment monitoring and intelligent manufacturing in the semiconductor sector.

• Rugged Tablets and Rugged Laptops

  Discover Winmate’s comprehensive range of rugged mobile computing devices. These devices combine Military Standard-certified durability, long battery life, and advanced data collection features (such as barcode scanners and RFID), making them ideal for logistics tracking, field inspections, digital work instructions, and mobile diagnostics, especially in fast-paced or mission-critical environments.

Let’s Connect at SEMICON Taiwan 2025 – Visit Us at Booth K2167

Whether you’re focused on smart manufacturing, industrial edge computing, ESG compliance, or semiconductor process automation, Winmate’s technology empowers your digital transformation journey.

Let’s connect and explore how Winmate can support your next-gen semiconductor or industrial application!

For more information about Winmate’s solutions, please visit contact our team or visit our website.