Fanless Design
What is this technology?
We use well-defined thermal analysis procedures to verify our LCD displays and Panel PC systems to meet the harsh environment applications. Especially in fanless cooling design, we develop a heat-sink or heat-pipe solution to conduct the heat and the airflow for the best thermal solution. In the fan cooling system, we will analyze the system's thermal profiles before we design it to make sure the most efficient heat convection.
How does this technology work?
The Panel PC combines the display with an industrial motherboard inside.
In the idea analysis stage, we develop a low power consumption motherboard (fan/ fanless) and provide dedicated thermal analysis technology by using thermal analysis software. Before production, we use an Infrared thermal video system (TVS) to check if our thermal design works.
We use the above Thermal Profile to select the critical monitoring points for Thermal testing. And we will also check if the measured temperatures exceed the defined specification of operating temperature for each individual component.
Technology/ Function Diagrams
Test Condition:
- Thermal Cycle settings: 30℃/45℃/50℃ ±3℃
- Humidity setting:0 + 5%RH
- AC Power: 110/220 VAC, 60/50Hz
- Test Times: Each Temperature 2 Hours
Benefits
Fanless and low power consumption meets harsh environment applications.
Versatile fan cooling design with thermal analysis
Low noise, well airflow convection with fan/fanless design .
Applications
- Industrial Automation
- Outdoor Kiosks
- Environmental & Utility Monitoring
- Communication