FA30SB3-210 NXP i.MX6 Dual Core ARM Box PC

KEY FEATURES

NXP i.MX6 Dual Core, 1GHz (Optional Quad Core)
Up to 2 GB LPDDR3
16GB eMMC
1 x RS-232/422/485, 1 x CANBus, 1 x USB A-Type, 1 x RJ45 (Optional PoE)
Micro HDMI
Optional DIDO

CERTIFICATIONS

DATASHEET RESOURCE

FA30SB3-210

NXP i.MX6 Dual Core ARM Box PC

Overview

Specification

Winmate ARM Box PC FA30SB3-210 with Low Power Consumption

NXP i.MX6 Dual Core 1GHz (Optional for Quad)

Unlike the x86 platform, which uses CISC (Complex Instruction Set Computing) architecture, ARM motherboards adopt RISC (Reduced Instruction Set Computing) architecture. RISC architecture's most significant features are ultra-low Power and Mobility, Ultra Small Form Factor Design, Low Cost, and Low Cost and Low Power does not equal Low Performance.

Winmate ARM Box PC FA30SB3-210 with Android and Linux Platforms

Support Android and Linux OS

Winmate ARM computing solution provides an Open and Unified Development Platform to minimize the development effort and increase resource efficiency when enabling an ARM-based embedded application.

Winmate ARM Box PC FA30SB3-210 with USB On-The-Go

USB OTG (On-The-Go) Interface on the External I/O

One USB OTG connector is added to BCM PPC10W-6MXQ ARM Panel PC external I/O ports enabling the system to perform the role of host or client. Communication is established whenever two USB devices are connected, and one of them is a USB OTG compatible. This feature is viral for low power mobile devices, primarily for the Android OS system.

System Specification

Processor

NXP i.MX6 Dual Core, 1.0GHz

Memory

1GB 2GB (Optional)

Storage

eMMC: Onboard 16 GB eMMC: Onboard 32 GB (Optional)

Operating System

Linux Ubuntu 18.04 (Optional) Android 6.0 (Optional) Debian 7.0 (Optional) Linux 4.1.15 QT 5.5 (Optional)

Support (Optional)

Mechanical

Dimension

224 x 47 x 127 mm

Weight

1.0 kg

Mounting

Desk Mount Wall Mount

Enclosure

Aluminum Housing

Cooling System

Fanless design

Environment

Operating Humidity

10% to 90% RH, Non-Condensing

Operating Temperature

-20°C to 60°C

Storage Temperature

-20°C to 60°C

Certification

CE, FCC

IO Ports

USB Port

1 x USB 2.0 (Type-A) 1 x USB OTG (Micro USB)

Serial Port

1 x RS232/422/485 (Default RS232) 2 x RS232/422/485 (Default RS232) (Optional)

LAN

1 x LAN RJ45 Connector with PoE(PD, 802.3 at)

Video

1 x Micro HDMI

SD Card Slot

1 x Micro SD card Slot

Indicator

1 x LED Indicator for power

DIDO

1 x 8pin(1x8) for DIO (3 x DI, 3 x DO, GND, 3.3V) (Optional)

CANBUS

1 x Mini PCIE

Power Input

1 x 12V DC, 2-Pin Terminal Block

Control

Button

1 x Power Button with LED Indicator (Optional)

Accessory

100~240V AC to DC Adapter Power Cord Terminal Block to 2.5Ø Female Adapter Cable

Power

Power Rating

12V DC

Adapter

12V 50W

POE

PoE (PD): follows IEEE 802.3at (25 W)

Solutions & Success Stories

Corporate

Support

Contact Us

News & Events

FA30SB3-210 NXP i.MX6 Dual Core ARM Box PC

KEY FEATURES

FA30SB3-210

NXP i.MX6 Dual Core ARM Box PC

NXP i.MX6 Dual Core 1GHz (Optional for Quad)

Support Android and Linux OS

USB OTG (On-The-Go) Interface on the External I/O

System Specification

Mechanical

Environment

Certification

IO Ports

Control

Accessory

Power

RELATED LINKS

COMPARED PRODUCT

Learn More

INQUIRY PRODUCT

FA30SB3-210 NXP i.MX6 Dual Core ARM Box PC

KEY FEATURES

FA30SB3-210

NXP i.MX6 Dual Core ARM Box PC

NXP i.MX6 Dual Core 1GHz (Optional for Quad)

Support Android and Linux OS

USB OTG (On-The-Go) Interface on the External I/O

System Specification

Mechanical

Environment

Certification

IO Ports

Control

Accessory

Power

RELATED LINKS